Semiconductor laser device capable of preventing degradation of characteristics

ABSTRACT

A semiconductor laser device includes an inner lower clad layer formed on a semiconductor layer, an active layer formed on the inner lower clad layer, an inner upper clad layer formed the active layer, a blocking layer formed on the inner upper clad layer to block current, wherein the blocking layer having a concave portion, and an outer upper clad layer formed to cover the blocking layer. Carriers are injected to the active layer through the outer upper clad layer and the concave portion of the blocking layer.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a semiconductor laser device anda method of method of manufacturing the same, and more particularly to asemiconductor laser device such as a red light laser device, and amethod of manufacturing the same.

[0003] 2. Description of the Related Art

[0004] An AlGaInP red light laser device is known as a laser used torecord data on recording media such as a digital video disc and amagneto-optic disc. As such a conventional red light laser, aself-aligned structure (SAS) type laser is disclosed in Japanese PatentNo. 2502835 as shown in FIG. 1. In this conventional laser device, ann-AlGaInP clad layer 102, an active layer 103 and a p-AlGaInP clad layer104, a GaInP etching stopper layer 105, a p-AlInP confining layer 106,an n-GaAs blocking layer 107, and a pAlGaAs upper clad layer 109 areformed on a GaAs substrate 101. The confining layer 106 and the blockinglayer 107 have a striped opening section, and the upper clad layer 109is formed on the etching stopper layer 105 in the striped openingsection. That is, the upper clad layer 109 contacts the confining layer106 and the blocking layer 107 in the striped opening.

[0005] The AlInP or AlGaInP layer does not absorb a laser beam and isused for the light confining layer 106 so that it is possible to down anoscillation threshold. However, when the conventional SAS type laser isoperated in a high output state, the degradation of the end surface of aresonator occurs due to optical damage such as Catastrophic OpticalDamage (COD) which has often occurred in general laser devices. Also, adrive current is injected from the opening section of the confininglayer 106 and extends in a lateral direction in the p-AlGaInP clad layer104. As a result, characteristics such as the oscillation threshold,slope efficiency and kink light output are degraded due to the lateralleakage current.

[0006] In conjunction with the above description, a semiconductor laseris disclosed in Japanese patent No. 2,502,835. In the semiconductorlaser of this reference, a first conductive type AlGaInP clad layer, anactive layer and a second conductive type AlGaInP clad layer are formedon a GaAs substrate of the first conductive type. A striped openingsection is formed on the clad layer. The semiconductor laser is composedof an AlInP or AlGaInP confining layer with a refractive index smallerthan that of the AlGaInP clad layer of the second conductive type. Thesemiconductor laser is further composed of a second conductive typeupper clad layer formed on the confining layer of the second conductivetype containing the opening section and having a wider band gap andlower refractive index than the AlGaInP clad layer.

SUMMARY OF THE INVENTION

[0007] Therefore, an object of the present invention is provide asemiconductor laser device such as an AlGaInP red light laser device ofa SAS-type in which COD on an end surface can be restrained in case ofthe high output operation, and a method of manufacturing the same.

[0008] Another object of the present invention is to provide asemiconductor laser device as a SAS-type laser in which the increase ofan oscillation threshold due to lateral leakage current can berestrained, and a method of manufacturing the same.

[0009] Still another object of the present invention is to provide asemiconductor laser device as a SAS-type laser in which the decrease ofslope efficiency can be restrained, and a method of manufacturing thesame.

[0010] Yet still another object of the present invention is to provide asemiconductor laser device as a SAS-type laser in which the decrease ofkink light output can be restrained, and a method of manufacturing thesame.

[0011] In an aspect of the present invention, a semiconductor laserdevice includes an inner lower clad layer formed on a semiconductorlayer, an active layer formed on the inner lower clad layer, an innerupper clad layer formed the active layer, a blocking layer formed on theinner upper clad layer to block current, wherein the blocking layerhaving a concave portion, and an outer upper clad layer formed to coverthe blocking layer. Carriers are injected to the active layer throughthe outer upper clad layer and the concave portion of the blockinglayer.

[0012] The thickness of the blocking layer in the concave portion isdesirably predetermined based on an emission angle and lateral mode of alaser beam emitted from the active layer.

[0013] Also, it is desirable that the outer upper clad layer contactsthe blocking layer in side walls and a bottom surface of the concaveportion. In this case, the thickness of the blocking layer in theconcave portion is desirable to be equal to or less than 0.2 μm.

[0014] Also, the impurity density of a portion of the inner upper cladlayer which corresponds to the concave portion of the blocking layer isdesirably higher than that of another portion of the inner upper cladlayer and less than an impurity density of the inner upper clad layer.In this case, the impurity density of the inner upper clad layer portioncorresponding to the concave portion is desirably more than 3×10¹⁶ cm⁻³.

[0015] Also, the semiconductor laser device may further include a caplayer formed on the blocking layer. In this case, the cap layer havingan opening corresponding to the concave portion of the blocking layer,and the inner upper clad layer is formed on the cap layer and contactsinner walls of the opening and side walls and a bottom surface of theconcave portion.

[0016] In another aspect of the present invention, a semiconductor laserdevice is formed by (a) forming an inner lower clad layer on asemiconductor layer; by (b) forming an active layer on the inner lowerclad layer; by (c) forming an inner upper clad layer the active layer;by (d) forming a blocking layer on the inner upper clad layer to blockcurrent; by (e) forming a concave portion in the blocking layer; and by(f) forming an outer upper clad layer to cover the blocking layer, suchthat carriers are injected to the active layer through the outer upperclad layer and the concave portion of the blocking layer.

[0017] The thickness of the blocking layer in the concave portion isdesirably predetermined based on an emission angle and lateral mode of alaser beam emitted from the active layer.

[0018] Also, in a method of manufacturing the semiconductor laserdevice, the outer upper clad layer is desirably formed to contact theblocking layer in side walls and bottom surface of the concave portion.In this case, the thickness of the blocking layer in the concave portionmay be equal to or less than 0.2 μm.

[0019] Also, the impurity density of a portion of the inner upper cladlayer which corresponds to the concave portion of the blocking layer isdesirably higher than that of another portion of the inner upper cladlayer and less than an impurity density of the inner upper clad layer.

[0020] The impurity density of the inner upper clad layer portioncorresponding to the concave portion may be more than 3×10¹⁶ cm⁻³.

[0021] Also, a cap layer is desirably formed on the blocking layer tohave an opening corresponding to the concave portion of the blockinglayer.

[0022] Also, the temperature when the outer upper clad layer may beformed is higher than a temperature when the inner lower clad layer, theactive layer, the upper clad layer, and the blocking layer are formed.

[0023] Also, an impurity may be injected from the outer upper clad layerinto a portion of the inner upper clad layer when the outer upper cladlayer is formed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0024]FIG. 1 is a cross sectional view of a conventional semiconductorlaser device;

[0025]FIGS. 2A to 2H are cross sectional views of a method ofmanufacturing of a semiconductor laser device according to an embodimentof the present invention; and

[0026]FIG. 3 is a plan view of the semiconductor laser device accordingto the embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, a semiconductor laser device of the presentinvention will be described below in detail with reference to theattached drawings.

[0028] In a 660-nm band semiconductor laser device according to anembodiment of the present invention, a multi-layer structure is formedon an AlGaInP laser device wafer. The multi-layer structure is formed onthe laser device wafer 20 by use of a reduced pressure OVPE method.

[0029]FIGS. 2A to 2H shows cross sectional views of the semiconductorlaser device along the line A-A in FIG. 3.

[0030] As shown in FIG. 2A, a si-doped GaAs buffer layer 2 (impurityconcentration=1×10¹⁸ cm⁻³) is grown on a Si-dope GaAs (001) substrate 1to have the thickness of 0.5 μm. Subsequently, a si-dopedAl_(0.75)GaO_(0.25)As outer clad layer 3 (impurity concentration=5×10¹⁷cm⁻³) is grown on the Si-doped GaAs buffer layer 2 to have the thicknessof 1.25 μm. Subsequently, a si-doped (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)Pinner clad layer 4 (impurity concentration=5×10¹⁷ cm⁻³) is grown on theSi-doped Al_(0.75)Ga_(0.25)As outer clad-layer 3 to have the thicknessof 0.3 μm. Then, an active layer 5 is grown on the si-doped(Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P inner clad layer 4. The active layer 5is composed of a GaInP active layer (the thickness of 7 nm×4 layers) andan (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P barrier layer (the thickness of 5nm×3 layers). Subsequently, a Zn-doped (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)Pinner clad layer 6 (impurity concentration 3×10¹⁶ cm³) is grown on theactive layer 5 to have the thickness of 0.3 μm. Subsequently, Si-dopedAlInP current blocking layer 7 (impurity concentration=5×10¹⁷ cm³) isgrown on the Zn-doped (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P inner clad layer6 to have the thickness of 0.5 μm. Subsequently, Zn-doped GaAs cap layer8 (impurity concentration=8×10¹⁷ cm⁻³) is grown on the Si-doped AlInPcurrent blocking layer 7 to have the thickness of 0.3 μm. These layersare grown in order. At this time, the growth temperature in such aprocess is constant and 680° C.

[0031] As shown in FIGS. 2B and 2C, a striped opening section is formedin the current blocking layer 7 of the laser device wafer 20. FIG. 2Ashows the (−110) cross section of the laser device wafer after a mesastripe is formed into the direction of [−110]. A SiO₂ film 9 is formedon the GaAs cap layer 8 of the laser device wafer 20 as shown in FIG.2A. The opening section 11 of 3 μm in wide is formed in the SiO₂ filminto the direction of [−110] by use of photolithography technique and amask for the opening section, as shown in FIG. 2B. Thus, a SiO₂ mask isformed such that only a current injection region is exposed in thestriped opening section 12.

[0032] Next, as shown in FIG. 2C, a striped opening section 12 is formedin the GaAs cap layer 8 by a selective wet etching method, using theSiO₂ film as a mask 14. Then, the SiO₂ mask 14 is removed as shown inFIG. 2D.

[0033] After the entire SiO₂ mask 14 is removed, the Si-doped AlInPcurrent blocking layer 7 is etched using the GaAs cap layer 8 with thestriped opening section 12 as a mask, as shown in FIG. 2F. The etchingis carried out toward the upper surface of the Zn-doped(Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P inner clad layer 6 in the stripedopening section 12. At this time, a thin bottom portion 16 is remainedin the striped opening section 12. The remaining bottom portion 16 hasthe thickness of 0.2 μm, as shown in FIG. 2F. Also, the radiation angleand lateral mode of the laser beam can be changed or adjusted inaccordance with the thickness of the remaining bottom portion 16 of thecurrent blocking layer 7. Therefore, the radiation angle and the sidemode of the laser beam can be controlled by adjusting the thickness ofthe remaining bottom portion 16, so that the control is possible to meetthe device characteristics. In addition, a current injection region 13is formed in the bottom of the striped opening section 12 to have thelength of 600 μm. Also, the side walls of the AlInP current blockinglayer 7 produced through the etching functions as a currentnon-injection portion 15.

[0034] Next, an outer clad layer 19 is formed on the cap layer 8, asshown in FIG. 2G. At this time, the striped opening section 12 is filledwith the outer clad layer 19. That is, the Zn-doped Al_(0.75)Ga_(0.25)Asouter clad layer 19 (impurity concentration=1×10¹⁸ cm⁻³) is formed onthe Zn-doped GaAs cap layer 8 to have the thickness of 1.25 μm. Throughthis process, the Zn-doped Al_(0.75)Ga_(0.25)As outer clad layer 19 isgrown in the inside of the striped opening section 12. At this time, torestrain the lateral leakage current in case of the laser oscillation,Zn ions are diffused and doped from the Zn-doped Al_(0.75)Ga_(0.25)Asouter clad layer 19 into the surface of the Zn-doped(Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P inner clad layer 6 as a currentinjection portion while the Zn-doped Al_(0.75)Ga_(0.75)As outer cladlayer 19 is grown. The Zn diffusion at this time increases the impurityconcentration of the Zn-doped (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P cladlayer 6 inner clad layer 19 in the current injection portion from 3×10¹⁶cm⁻³ to 3×10¹⁷ cm⁻³. The difference in the impurity concentrationrestrains the lateral leakage current in case of the laser oscillationand improves a threshold, slope efficiency and kink light output. Forthis region selective doping, it is desirable that the Zn concentrationof the Zn-doped Al_(0.75)Ga_(0.75)As outer clad layer 19 is equal to ormore than 5×10¹⁷ cm⁻³ and that the growth temperature is equal to orhigher than 700° C. Subsequently, a Zn-doped GaAs contact layer 21(impurity concentration=3×10¹⁸ cm³) is grown on the Zn-dopedAl_(0.75)Ga_(0.25)As outer clad layer 19 to have the thickness of 1 μm.

[0035] Finally, as shown in FIG. 2H, the p and n contact electrodes 22and 23 are formed on the both sides of the wafer 20 formed in this way.Thus, 660-nm band laser device wafer 24 is obtained. The laser devicewafer is cleaved along the direction of [110] orthogonal to the lengthdirection of the striped opening section 12 and forms the end surfacesof a resonator. At this time, it is desirable that the distance betweenthe end surfaces of the resonator is in a range of 2 μm to 50 μm. Afterthe cleaving, an Al₂O₃ film and Al₂O₃/a-Si multiple film are formed tocontrol the light reflectivity of 10% at the front, 90% at the back. Thelaser device is coupled to a heat sink. Thus, the laser device of thepresent invention is completed.

[0036] In the above-mentioned SAS type red light laser device, thenon-injection portions are formed using the current blocking layer 7.Therefore, the end surface COD degradation can be restrained even incase of high output operation and a long-term stable operation can berealized. Also, the thickness of the remaining bottom portion 16 of thecurrent blocking layer 7 can be changed, so that the lateral mode andradiation angle of the laser beam can be controlled. Moreover, in caseof the growth of the outer clad layer 19, the Zn impurities areselectively diffused into the current injection region of the inner cladlayer 6, so that the lateral leakage current of the injection current isrestrained in the above-mentioned SAS type laser device. The restraintof the lateral leakage current reduces an oscillation threshold andimproves slope efficiency. Moreover, the kink light output in thecurrent-light output characteristic is improved.

[0037] The above mentioned SAS type laser oscillation device has the endsurface non-injection structure. However, the structure can bemanufactured through twice growth processes like the conventional SAStype laser. Accordingly, the excellent productivity is kept.

[0038] In the laser device of the present invention, the end surface CODdegradation can be restrained in case of high output operation of thelaser device, and the restraint effect is high, especially, in theAlGaInP red light laser device of an SAS type. Moreover, the AlGaInP redlight laser restrains the increase of the oscillation threshold by thelateral leakage current. Also, the decrease of the slope efficiency andthe kink light output can be restrained. In addition, the excellentproductivity is not changed.

[0039] As described above, according to the present invention, a currentblocking layer is left and the current non-injection portion is formed.Also, the carrier concentration of the outer clad layer in the stripedopening section 12 is higher than the carrier concentration of the innerclad layer directly below the striped opening section. The currentnon-injection structure is formed using the current blocking layer 7 torestrain the end surface COD degradation in case of high outputoperation and to realize a long-term stable operation. Also, the lateralleakage current of the injection current is restrained so that thereduction of the oscillation threshold, the improvement of the slopeefficiency and kink light output can be attained.

What is claimed is:
 1. A semiconductor laser device comprising: an innerlower clad layer formed on a semiconductor layer; an active layer formedon said inner lower clad layer; an inner upper clad layer formed saidactive layer; a blocking layer formed on said inner upper clad layer toblock current, wherein said blocking layer having a concave portion; andan outer upper clad layer formed to cover said blocking layer, andwherein carriers are injected to said active layer through said outerupper clad layer and said concave portion of said blocking layer.
 2. Thesemiconductor laser device according to claim 1 , wherein a thickness ofsaid blocking layer in said concave portion is predetermined based on anemission angle and lateral mode of a laser beam emitted from said activelayer.
 3. The semiconductor laser device according to claim 1 , whereinsaid outer upper clad layer contacts said blocking layer in side wallsand bottom surface of said concave portion.
 4. The semiconductor laserdevice according to claim 3 , wherein a thickness of said blocking layerin said concave portion is equal to or less than 0.2 μm.
 5. Thesemiconductor laser device according to claim 1 , wherein an impuritydensity of a portion of said inner upper clad layer which corresponds tosaid concave portion of said blocking layer is higher than that ofanother portion of said inner upper clad layer and less than an impuritydensity of said inner upper clad layer.
 6. The semiconductor laserdevice according to claim 1 , wherein said impurity density of saidinner upper clad layer portion corresponding to said concave portion ismore than 3×10¹⁶ cm⁻³.
 7. The semiconductor laser device according toclaim 1 , further comprising a cap layer formed on said blocking layer,and wherein said cap layer having an opening corresponding to saidconcave portion of said blocking layer, and said inner upper clad layeris formed on said cap layer and contacts inner walls of said opening andside walls and a bottom surface of said concave portion.
 8. A method ofmanufacturing a semiconductor laser device, comprising the steps of: (a)forming an inner lower clad layer on a semiconductor layer; (b) formingan active layer on said inner lower clad layer; (c) forming an innerupper clad layer said active layer; (d) forming a blocking layer on saidinner upper clad layer to block current; (e) forming a concave portionin said blocking layer; and (f) forming an outer upper clad layer tocover said blocking layer, such that carriers are injected to saidactive layer through said outer upper clad layer and said concaveportion of said blocking layer.
 9. The method according to claim 8 ,wherein a thickness of said blocking layer in said concave portion ispredetermined based on an emission angle and lateral mode of a laserbeam emitted from said active layer.
 10. The method according to claim 8, wherein said (f) forming step comprises the step of: forming saidouter upper clad layer to contact said blocking layer in side walls andbottom surface of said concave portion.
 11. The method according toclaim 10 , wherein a thickness of said blocking layer in said concaveportion is equal to or less than 0.2 μm.
 12. The method according toclaim 8 , wherein an impurity density of a portion of said inner upperclad layer which corresponds to said concave portion of said blockinglayer is higher than that of another portion of said inner upper cladlayer and less than an impurity density of said inner upper clad layer.13. The method according to claim 8 , wherein said impurity density ofsaid inner upper clad layer portion corresponding to said concaveportion is more than 3×10¹⁶ cm⁻³.
 14. The method according to claim 8 ,further comprising the step of: forming a cap layer on said blockinglayer to have an opening corresponding to said concave portion of saidblocking layer.
 15. The method according to claim 8 , wherein atemperature when said outer upper clad layer is formed is higher than atemperature when said inner lower clad layer, said active layer, saidupper clad layer, and said blocking layer are formed.
 16. The methodaccording to claim 8 , wherein an impurity is injected from said outerupper clad layer into a portion of said inner upper clad layer when saidouter upper clad layer is formed.